*For representation only.
630-35AB
Wakefield Thermal
Active
Heat Sinks Omnidirectional Pin Fin Heat Sink for 35mm BGA, 35x8.9mm
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Technical Specifications
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Shape | Square, Pin Fins |
| Length | 1.378" (35.00mm) |
| Width | 1.378" (35.00mm) |
| Diameter | - |
| Fin Height | 0.350" (8.89mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 5.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural | - |
| Material | Aluminum |
| Material Finish | Black Anodized |
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Product Attributes
| Packaging | |
| Standard Pack Qty | 750 |
2,654
Units In Stock
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- 24-hour response
- Global shipping
- Genuine parts guaranteed
Test report available upon request —
view sample report
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Key Specifications
| Category | Heat Sinks |
| RoHS | RoHS Compliant |
| Lifecycle | |
| Lead Time | 112 Days (from factory) |
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Documentation
Datasheet not available
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Compliance & Export
| Country / Standard | Code |
|---|---|
| CNHTS | 7616991090 |
| USHTS | 8542900000 |
| ECCN | EAR99 |
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Product Overview
630-35AB by Wakefield Thermal is a heat sinks designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.
The fan and thermal management category includes products and materials used to facilitate heat transfer and/or air movement, and accessories related to such products. Along with AC and DC fans and heat sinks, thermally-conductive adhesives, thermal interface products, heat pipes, and thermoelectric (peltier) modules are included. In context of electronic devices and systems, such products are comonnly used to maintain the temperatures of power-dissipationg components within acceptable operating limits.
