No Image
*For representation only.
511-6M
Wakefield Thermal
Active
Heat Sinks High Fin Density Heat Sink, IGBTs, Relays, Mill, 132.33x152.4mm
Technical Specifications
| Type | Top Mount, Extrusion |
| Package Cooled | Power Modules |
| Attachment Method | Adhesive |
| Shape | Rectangular, Fins |
| Length | 6.000" (152.40mm) |
| Width | 5.210" (132.33mm) |
| Diameter | - |
| Fin Height | 2.350" (59.69mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | - |
| Thermal Resistance @ Natural | 0.65°C/W |
| Material | Aluminum |
| Material Finish | - |
Product Attributes
| Packaging | |
| Standard Pack Qty | 1 |
7,866
In Stock
Packaging:
✔ 24h Response
✔ Global Shipping
✔ Genuine Parts
✔ Global Shipping
✔ Genuine Parts
Test Report Available Upon Request
click here to view sample report
Key Specifications
| Category | Heat Sinks |
| RoHS | RoHS Compliant |
| Lifecycle | |
| Reported Lead Time | 70 Days (from factory) |
Documentation
Not Available
Compliance & Export Information
| Country | Code |
|---|---|
| CNHTS | 7616991090 |
| USHTS | 7616995190 |
| TARIC | 7616999099 |
| ECCN | EAR99 |
Product Overview
511-6M by Wakefield Thermal is a heat sinks designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.
The fan and thermal management category includes products and materials used to facilitate heat transfer and/or air movement, and accessories related to such products. Along with AC and DC fans and heat sinks, thermally-conductive adhesives, thermal interface products, heat pipes, and thermoelectric (peltier) modules are included. In context of electronic devices and systems, such products are comonnly used to maintain the temperatures of power-dissipationg components within acceptable operating limits.
