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EFR32MG21B010F512IM32-DR Silicon Labs
*For representation only.

EFR32MG21B010F512IM32-DR

RF System on a Chip - SoC Mighty Gecko, QFN32, 2.4G, 10dB, mesh multiprotocol, 512kB, 64kB(RAM), 20 GPIO
Technical Specifications
Type TxRx + MCU
RF Family/Standard 802.15.4, Bluetooth
Protocol Bluetooth v5.0, Thread, Zigbee®
Modulation DSSS, GFSK, O-QPSK
Data Rate (Max) 2Mbps
Power - Output 10dBm
Sensitivity -105dBm
Memory Size 512kB Flash, 64kB RAM
Serial Interfaces GPIO, I2C, I2S, IrDA, PWM, SPI, UART, USART
GPIO 20
Voltage - Supply 1.71V ~ 3.8V
Current - Receiving 8.8mA ~ 9.8mA
Current - Transmitting 9.3mA ~ 186.5mA
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 32-VFQFN Exposed Pad
Supplier Device Package 32-QFN (4x4)
📦 Product Attributes
Packaging Reel
Standard Pack Qty 2500
🔁 Alternate / Replacement Parts
Alternate Packaging EFR32MG21B010F512IM32-D
Suggested Replacement
11,685
Units In Stock
📦 Reel
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🔑 Key Specifications
Category RF System on a Chip - SoC
RoHS RoHS Compliant
Lifecycle New Product
Lead Time 56 Days (from factory)
📄 Documentation
⬇ Download Datasheet
🌐 Compliance & Export
Country / Standard Code
USHTS 8542310070
ECCN 5A992.C
Product Overview

EFR32MG21B010F512IM32-DR by Silicon Labs is a rf system on a chip - soc designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.

Radio Frequency and Intermediate Frequency (RF/IF) products are used for wireless transmission of information by means of electromagnetic radiation. Radio Frequency Identification (RFID) is a specific subset of general RF applications, characterized by use of small, inexpensive devices known as "tags" capable of containing a limited amount of information, that can be wirelessly retrieved (and in some cases modified) through the use of a specialized device known as a "reader" and which are commonly used for object or material tracking, inventory, and similar purposes. Products found within this category may range from finished products for end use, to component-level products and materials from which such finished goods are assembled.

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