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MKW36A512VFP4R NXP Semiconductors
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MKW36A512VFP4R

RF System on a Chip - SoC Kinetis W 32-bit MCU, ARM Cortex
Technical Specifications
Programmable Not Verified
Type TxRx + MCU
RF Family/Standard Bluetooth
Protocol Bluetooth v5.0
Modulation FSK, GFSK, MSK
Frequency 2.4GHz
Data Rate (Max) 1Mbps
Power - Output 5dBm
Sensitivity -95dBm
Memory Size 265kB Flash, 64kB RAM
Serial Interfaces I2C, SPI, UART
Voltage - Supply 1.71V ~ 3.6V
Current - Receiving 6.3mA
Current - Transmitting 5.7mA
Operating Temperature -40°C ~ 105°C (TA)
Grade Automotive
Qualification AEC-Q100
Mounting Type Surface Mount, Wettable Flank
Package / Case 40-VFQFN Exposed Pad
Supplier Device Package 40-HVQFN (6x6)
📦 Product Attributes
Packaging Reel
Standard Pack Qty 2000
🔁 Alternate / Replacement Parts
Alternate Packaging MKW36A512VFP4
Suggested Replacement
10,722
Units In Stock
📦 Reel
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🔑 Key Specifications
Category RF System on a Chip - SoC
RoHS RoHS Compliant
Lifecycle
Lead Time 112 Days (from factory)
📄 Documentation
⬇ Download Datasheet
🌐 Compliance & Export
Country / Standard Code
USHTS 8542310070
ECCN 5A992.C
Product Overview

MKW36A512VFP4R by NXP Semiconductors is a rf system on a chip - soc designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.

Radio Frequency and Intermediate Frequency (RF/IF) products are used for wireless transmission of information by means of electromagnetic radiation. Radio Frequency Identification (RFID) is a specific subset of general RF applications, characterized by use of small, inexpensive devices known as "tags" capable of containing a limited amount of information, that can be wirelessly retrieved (and in some cases modified) through the use of a specialized device known as a "reader" and which are commonly used for object or material tracking, inventory, and similar purposes. Products found within this category may range from finished products for end use, to component-level products and materials from which such finished goods are assembled.

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