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XCVE1752-2MLENSVG1369

SoC FPGA XCVE1752-2MLENSVG1369
Technical Specifications
Architecture MPU, FPGA
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
RAM Size 256KB
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 600MHz, 1.4GHz
Primary Attributes Versal™ AI Edge FPGA, 1M Logic Cells
Operating Temperature 0°C ~ 110°C (TJ)
Package / Case 1369-BFBGA, FCBGA
Supplier Device Package 1369-FCBGA (35x35)
📦 Product Attributes
Packaging
Standard Pack Qty 24
🔁 Alternate / Replacement Parts
Alternate Packaging
Suggested Replacement
5,519
Units In Stock
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🔑 Key Specifications
Category SoC FPGA
RoHS RoHS Compliant
Lifecycle
Lead Time 154 Days (from factory)
📄 Documentation
Datasheet not available
🌐 Compliance & Export
Country / Standard Code
USHTS 8542310070
Product Overview

XCVE1752-2MLENSVG1369 by AMD / Xilinx is a soc fpga designed for reliable performance in electronic applications. It is widely used in industrial, automotive, and power management systems.

Integrated circuits combine a large number of transistors and other elementary electronic components in miniaturized form into a single physical device, that is designed for a specific purpose or function and characterized by its performance of that function rather than by the behavior of its component pieces. Examples include microcontrollers, battery monitors and charge controllers, analog to digital converters, operational amplifiers, logic gates, voltage regulators, gate drivers, motro controllers, and others.

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