Memory Modules DDR4-3200, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8), anti-sulfur

Memory Modules DDR4-3200, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8), anti-sulfur

Computer-On-Modules - COM SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, 4 GB LPDDR4 , 32 GB eMMC, -40 C to 85 C

Computer-On-Modules - COM SMARC 2.1 Short Size Module with Quad Core NXP i.MX8M-PLUS, 4 GB LPDDR4 , 32 GB eMMC, -40 C to 85 C

I/O Controllers ADi-SIOG-FPGA/12V-2MB- 12V PWR_IN-SA metal cover- Cyclone IV FPGA EP4CGX30CF23C8N- PIC18F46J11 Logging Processor- 8MB SRAM- 32x DIO

I/O Controllers ADi-SIOG-FPGA/12V-2MB- 12V PWR_IN-SA metal cover- Cyclone IV FPGA EP4CGX30CF23C8N- PIC18F46J11 Logging Processor- 8MB SRAM- 32x DIO

Computer-On-Modules - COM nanoX-BT-E3845-4GMini COM Express Type 10 module with Intel Atom E3845 at 1.91 GHz and 4GB non ECC DDR3L

Computer-On-Modules - COM nanoX-BT-E3845-4GMini COM Express Type 10 module with Intel Atom E3845 at 1.91 GHz and 4GB non ECC DDR3L

Interface Modules LP H/P IEEE488 GPIB INTERFACE CRD PCI

Daughter Cards & OEM Boards SP-07WP-AL3930, 2GB, w/ IO, 12V

Computer-On-Modules - COM EGX-MXM-A4500-8GB-80W/Adlink logo

Wall Mount AC Adapters Input: 90-264Vac/40WOutput: 24Vdc/1.67AFrequency: 47 - 63HzEfficiency(Typ.): 91% Operating Temperature: -30-+70degC, UL/TUV/BSMI/PSE/CE/FCC/CB/CCC/DOE Level 6

Wall Mount AC Adapters Input: 90-264Vac/40WOutput: 24Vdc/1.67AFrequency: 47 - 63HzEfficiency(Typ.): 91% Operating Temperature: -30-+70degC, UL/TUV/BSMI/PSE/CE/FCC/CB/CCC/DOE Level 6

Memory Cards microSD, SDXC/SDHC, 32GB, UHS-I U1/V10/A1, 100R/70W, 2.7-3.6V, Endurance:80 TB, 3D TLC, 11x15x0.8mm, OP Temp:-25 85, with plastic case

Memory Cards microSD, SDXC/SDHC, 32GB, UHS-I U1/V10/A1, 100R/70W, 2.7-3.6V, Endurance:80 TB, 3D TLC, 11x15x0.8mm, OP Temp:-25 85, with plastic case

I/O Controllers ADi-SIOG-FPGA/12V-4MB- 12V PWR_IN-SA metal cover- Cyclone IV FPGA EP4CGX30CF23C8N- PIC18F46J11 Logging Processor- 4MB SRAM- 32x DIO- 8x HW Meter- 4x COM Port

I/O Controllers ADi-SIOG-FPGA/12V-4MB- 12V PWR_IN-SA metal cover- Cyclone IV FPGA EP4CGX30CF23C8N- PIC18F46J11 Logging Processor- 4MB SRAM- 32x DIO- 8x HW Meter- 4x COM Port

Solid State Drives - SSD M.2 2242, NVMe PCIe Gen 3x2 B+M Key256GB, Transcend TS256GMTE452TSupply voltage/Tolerance:3.3V+/-5% Operating Temperature: 0- 70CSequential : Read Up to 1700 MB/s, Write Up to 1250 MB/sForm Factor: 22mm x 42mm x 3.58mm

Solid State Drives - SSD M.2 2242, NVMe PCIe Gen 3x2 B+M Key256GB, Transcend TS256GMTE452TSupply voltage/Tolerance:3.3V+/-5% Operating Temperature: 0- 70CSequential : Read Up to 1700 MB/s, Write Up to 1250 MB/sForm Factor: 22mm x 42mm x 3.58mm

Computer-On-Modules - COM LEC-AL-N3350-4G-64G-CT SMARC Short Size Module with Intel Celeron? N3350, dual core, 4 GB DDR3L, 64GB eMMC, 0 C to 60 C

Computer-On-Modules - COM LEC-AL-N3350-4G-64G-CT SMARC Short Size Module with Intel Celeron? N3350, dual core, 4 GB DDR3L, 64GB eMMC, 0 C to 60 C

Computer-On-Modules - COM SMARC 2.1 with MediaTek Genio 1200 platform 8 GB LPDDR4 64 GB UFS AC wifi BT

Computer-On-Modules - COM SMARC 2.1 with MediaTek Genio 1200 platform 8 GB LPDDR4 64 GB UFS AC wifi BT

Computer-On-Modules - COM EGX-MXM-A2000-8G-35W/Adlink logo

I/O Controllers 24V PWR_IN- SA metal cover- ARM Cortex-M4F TM4C1299KCZAD- PIC18F46J11 Logging Processor- 1MB SRAM- 32x DIO- 8x HW Meter & 1x SEC Meter- 4x COM Port- 1x MDB CONN- 2x Feature CONN

I/O Controllers 24V PWR_IN- SA metal cover- ARM Cortex-M4F TM4C1299KCZAD- PIC18F46J11 Logging Processor- 1MB SRAM- 32x DIO- 8x HW Meter & 1x SEC Meter- 4x COM Port- 1x MDB CONN- 2x Feature CONN

Memory Modules DDR4-2400, 16GB, 2Gx72, R-DIMM 288P, 1.2V, Rank:2, CL17, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(1Gx8)

Memory Modules DDR4-2400, 16GB, 2Gx72, R-DIMM 288P, 1.2V, Rank:2, CL17, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(1Gx8)

Memory Cards microSD, SDXC/SDHC, 32GB, C10/UHS-I U1, 100R/70W, 2.7-3.6V, Endurance:3K P/E, MLC, 11x15x1mm, OP Temp:-25-85

Memory Cards microSD, SDXC/SDHC, 32GB, C10/UHS-I U1, 100R/70W, 2.7-3.6V, Endurance:3K P/E, MLC, 11x15x1mm, OP Temp:-25-85

Single Board Computers 4HP cPCI-6540 with Intel Xeon E-2276ML and 32GB DDR4-2666 ECC

Single Board Computers 4HP cPCI-6540 with Intel Xeon E-2276ML and 32GB DDR4-2666 ECC

Memory Modules SDRAM PC133, 512MB, 32Mx16, SO-DIMM 144P, 3.3V, Rank:1, CL3, Non-ECC, OP Temp:0 70, Fix Die:Yes(J-die), PROMOS chip(32Mx16)

Memory Modules SDRAM PC133, 512MB, 32Mx16, SO-DIMM 144P, 3.3V, Rank:1, CL3, Non-ECC, OP Temp:0 70, Fix Die:Yes(J-die), PROMOS chip(32Mx16)

Industrial Box PCs ROScube-X, w/GMSL2, RQX-59G, JETSON AGX ORIN 32GB LPDDR5, 64GB eMMC

Industrial Box PCs ROScube-X, w/GMSL2, RQX-59G, JETSON AGX ORIN 32GB LPDDR5, 64GB eMMC

Memory Modules DDR4-2666, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8)

Memory Modules DDR4-2666, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8)

Memory Modules DDR4-2400, 32GB, 4Gx64, SO-DIMM 260P, 1.2V, CL17, Rank:2, Non-ECC, OP Temp:0-85, Fix Die: No, Chip(2048Mx8*16), height 30 mm

Memory Modules DDR4-2400, 32GB, 4Gx64, SO-DIMM 260P, 1.2V, CL17, Rank:2, Non-ECC, OP Temp:0-85, Fix Die: No, Chip(2048Mx8*16), height 30 mm

Terminal Block Interface Modules 16CH OPTO-ISOLATED IN 8 RELAY